Bob Shine, Telescent‘s VP of Marketing and Product Management, is set to speak at the IEEE Summer Topical Meeting Series in Bridgetown, Barbados from July 15-17, 2024. He will participate in a panel discussion titled “OIIP: Optical Interconnects and Integrated Photonics for AI/ML/HPC Applications,” focusing on the latest advancements and future potential of optical technologies in accelerating artificial intelligence, machine learning, and high-performance computing.

The IEEE Summer Topical Meeting Series is a prestigious event that brings together experts from the global scientific and engineering communities to discuss new ideas, breakthroughs, and challenges in optics and photonics. Shine’s participation in this event highlights Telescent’s commitment to advancing optical interconnect technologies and their applications in AI, machine learning, and high-performance computing.

Shine expressed his enthusiasm for the opportunity, stating, “Telescent is at the forefront of transforming optical interconnect technologies that are critical for the next generation of AI and computing technologies. I am honored to share our vision along with others on the panel and work with peers and pioneers in the field at this important gathering.”

This speaking engagement follows Telescent’s recent announcement of a significant milestone – receiving the largest order in the company’s history from one of the world’s top cloud and AI hyperscale data center operators. This achievement underscores Telescent’s growing influence in the field of optical networking and data center operations.

Telescent has been making waves in the industry with its innovative automated fiber cross-connect solutions. The company’s technology brings automation to the fiber layer of optical networks, offering network and data center operators the advantages of reduced operating expenses, fewer manual errors, and new service opportunities.

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