Data Center POST had the opportunity to connect with Shahar Belkin, Chief Evangelist at ZutaCore. Starting in 2018, he has led the development and product organizations, contributing to the advancement of next-generation two-phase cooling solutions for high-power silicon and data center infrastructure. Since 2024, he has served as the company’s Chief Evangelist, representing ZutaCore’s technology vision across the global AI and high-performance computing ecosystem.
What does ZutaCore do?
ZutaCore® delivers waterless, two-phase direct-to-chip liquid cooling for data centres. The technology removes heat directly from CPUs and GPUs using a non-conductive dielectric fluid rather than water. Our flagship solution, ZutaCore HyperCool®, helps AI, cloud and enterprise data centres cool higher-power processors, increase compute density and cut cooling energy use in half.
Proven at scale in demanding data centre environments, HyperCool eliminates water risk at the server level and gives operators a safer way to move beyond air cooling. Its cold plates, dielectric fluid, manifolds, cooling distribution units and control software are engineered together as one thermal architecture rather than sold as separate parts. In AI cooling, performance depends on how effectively the entire system works together, rather than on any single component.
What problems does ZutaCore solve in the market?
AI and high-performance workloads are pushing CPUs and GPUs to power levels that traditional air cooling can struggle to manage efficiently. We help data centre operators address this by removing heat directly at the chip, supporting higher-density compute without bringing water inside the server.
HyperCool enables this through a waterless, closed-loop, two-phase architecture that uses a non-conductive dielectric fluid to absorb and remove heat from processors. As rack densities continue to rise, this helps operators reduce water risk, improve cooling efficiency and scale AI infrastructure more safely.
What are ZutaCore’s core products or services?
Our flagship product is HyperCool, a waterless, two-phase direct-to-chip liquid cooling solution used across AI, HPC, cloud, financial services, enterprise and colocation environments. Every part of HyperCool is engineered as one integrated thermal system rather than optimised in isolation. It follows the same systems-engineering approach a Formula 1 team applies to overall lap time rather than any single part of the car.
HyperCool uses cold plates mounted directly on CPUs and GPUs. Inside each cold plate, our dielectric fluid absorbs heat from the processor, boils into vapour and carries that heat away from the chip. The vapour then condenses back into liquid in the heat rejection unit and recirculates through the closed-loop system.
We have also introduced OmniTherm™, a two-phase cold plate designed for advanced server configurations, including reversed orientation, inverted mounting, back-side power delivery and non-standard layouts. It gives data centre operators and system designers more thermal flexibility for high-density AI, HPC and cloud infrastructure.
What markets do you serve?
We serve the digital infrastructure market. Our focus is on AI data centres, high-performance computing, cloud, enterprise, colocation and edge environments. We also work with performance-sensitive sectors such as financial services and high frequency trading.
In these environments, cooling can affect latency consistency and hardware performance. It can also influence whether firms can deploy dense compute in strategic colocation facilities close to exchanges and liquidity venues.
What challenges does the global digital infrastructure industry face today?
Data centres are trying to support far more compute while using energy, space and water more carefully. AI workloads are pushing chip power and rack densities beyond what legacy air cooling was designed to handle. Facilities that once planned for tens of kilowatts per rack are now planning for much higher densities, and the industry is already discussing megawatt-class racks.
Power and cooling capacity are now also shaping growth, so operators need systems that use less energy, keep water away from IT equipment and reduce deployment risk. Yet much of the industry still discusses cooling in terms of individual parts, whether the cooling distribution unit, cold plate or coolant. The reality is that as power and density climb, cooling has become a systems-engineering challenge, where the design of each component affects the performance of the whole system.
How is ZutaCore adapting to these challenges?
We are scaling HyperCool from rack-level deployments to end-of-row and larger cooling systems capable of supporting higher-density AI infrastructure. By removing heat at the processor through a sealed, waterless two-phase loop, HyperCool helps operators reduce cooling energy and keep water away from IT equipment.
We are also validating multi-megawatt operation and designing systems around the practical requirements of live data centres. At our facility in Israel, we have built a 2 MW end-of-row emulation platform that replicates real-world thermal and facility conditions without using live IT equipment. This allows us to validate performance and stability at multi-megawatt scale ahead of customer deployment. OmniTherm extends the same approach to advanced server designs, including reversed orientation and back-side power delivery, giving operators more flexibility as AI hardware becomes denser.
What can we expect to see/hear from ZutaCore in the future?
We will use our recent $100 million Series C funding round to expand global commercialisation and advance R&D for next-generation AI and HPC chip cooling. The funding will also support work on in-package thermal management, megawatt-class deployments and integration with existing air and single-phase cooling systems.
We have more than 75 deployments worldwide today, and we are focused on scaling our platform as operators look to support higher compute density, reduce water risk and meet rising AI infrastructure demand. Our two-phase platform is designed to support next generation AI and HPC processors exceeding 4,000 watts. OmniTherm now supports full-power operation for the NVIDIA RTX PRO™ 6000 Blackwell Server Edition in a single-slot PCIe form factor. We will continue to advance the platform to meet the evolving requirements of AI-driven data centres.
What upcoming industry events will you be attending?
We will then be a Gold Sponsor at DataCloud USA in Austin, Texas on 2 and 3 September, where we will moderate the panel “Keeping it cool: evaluating air, liquid and hybrid approaches for high-density workloads”.
ZutaCore will also be a Sapphire Sponsor at the OCP Global Summit in San Jose, California from 12 to 15 October. On 15 October at 1:05pm, we will host the panel “Reducing Operational Complexity through Standard Two-Phase Liquid Cooling for AI Infrastructure” with Wiwynn, ASRockRack and Corinitis. We will also attend SuperComputing’26 in Chicago, Illinois from 15 to 20 November.
Do you have any recent news you would like us to highlight?
We recently announced our $100 million Series C funding round, with investment from Mitsubishi Electric, Carrier Ventures, Samsung Electronics through Samsung Ventures and additional investors. The funding will support global commercialisation, further R&D and continued work on cooling technologies for next-generation AI and HPC processors.
We also announced more than 75 deployments worldwide across the Americas, Europe and Asia, along with senior hires across finance, people, research and development and operations as we scale for further global growth. Those hires include Yaniv Reinhold as Chief Financial Officer, Sarah Warshavsky Oberman as Chief People Officer, Yoni Nir as Chief R&D Officer and Sharon Shafran as Chief Operating Officer, joining CEO Erez Freibach, President and CRO Brian Lillie, Chief Product and Technology Officer My Truong and Chief of Staff Susan Mor.
Is there anything else you would like our readers to know about ZutaCore and capabilities?
HyperCool is more than cold plates and fluid. It includes HyperCool Cloud, our software layer for real-time monitoring, control and optimisation across racks, rows and sites. The full system, with its hardware and software working together, is what customers are deploying.
ZutaCore was named an IDC Innovator in 2025, won Best Supercomputing Cooling Innovation at ISC 2025, and is a member of the Sustainable Digital Infrastructure Alliance and the STAC Alliance. Our $100 million Series C, backed by strategic investors including Mitsubishi Electric, Carrier Ventures and Samsung Electronics, reflects strong confidence in this approach as AI infrastructure moves to megawatt-class density.
Where can our readers learn more about ZutaCore?
Readers can visit the ZutaCore website and follow ZutaCore on LinkedIn to learn more about our technology, company news and upcoming events.
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